Imaging device

ABSTRACT

An imaging device  100  includes: an imaging element  110;  a main circuit substrate  120;  a mounting component  130  mounting the imaging element  110;  a metal plate  150  disposed between the mounting component  130  and the main circuit substrate  120;  a mount  140  supporting the metal plate  150  by connection sections  160  being fixed at at least three fixing points; elastic components  165  urging the connection sections  160  at each fixing point of the mount  140;  and an electrically-conductive component  190  electrically connecting between a ground conductor of the main circuit substrate  120  and the metal plate  150.  The electrically-conductive component  190  is disposed such that a connection point with the metal plate  150  is positioned in a area formed by the at least three fixing points being sequentially connected in the case of a back surface of the metal plate  150  being viewed in a direction orthogonal thereto.

BACKGROUND

1. Field

The present disclosure relates to imaging devices such as digital still cameras and the like, and more particularly to imaging devices that allow image interference caused by an external noise to be reduced.

2. Description of the Related Art

In recent years, opportunities are increased in which imaging devices such as digital still cameras and the like are used in environments where portable information terminals, such as mobile telephones and PHSs (personal handyphone systems), which emit electromagnetic waves, are used. Further, there may be opportunities of imaging devices such as digital still cameras and the like being used in environments where intense electromagnetic waves are emitted, e.g. in the vicinity of a radio station or a television station.

In a case where the imaging device is used in such an environment, the imaging device is likely to be subjected to an electromagnetic interference. Hereinafter, an environment in which imaging devices are likely to be subjected to such an electromagnetic interference is referred to as an “intense electric field environment.” If an imaging device such as a digital still camera is used in the intense electric field environment, an image taken by the imaging device may contain a stripe pattern noise (beat noise), and image interference may be caused.

The higher a performance of an imaging element of the imaging device is (the higher the sensitivity of an imaging element to be used is), the more significant the image interference is. Further, in an imaging element built into an imaging device having been downsized as a result of the sizes of imaging devices being reduced, an amount of coupling of intense electric field noise from the outside is increased, so that the image interference becomes more significant.

Causes of the image interference include entering of an external electromagnetic wave into an image signal line of an imaging element. Therefore, as the conventional arts, a structure is disclosed in which an electrically-conductive filter is additionally provided on a surface of a lens, and an imaging element is shielded from intense electric field noises which may enter the imaging element (see, for example, Japanese Laid-Open Patent Publication No. 2008-211378).

SUMMARY

The inventors of the present application have considered that a metal plate is mounted to the reverse side of a mounting component for mounting an imaging element, in order to dissipate heat generated in the imaging element. However, when the metal plate is subjected to an electromagnetic wave from the outside, the metal plate secondarily radiates the electromagnetic wave. Although heat generated in the imaging element is dissipated by means of the metal plate, the metal plate enhances electromagnetic field noises that enter the imaging element. To address such a problem, the inventors of the present application have considered that a metal plate is electrically connected to a ground conductor of a main circuit substrate in order to stabilize a potential of the metal plate. In this case, an electrically-conductive component that is connected to the ground conductor of the main circuit substrate is pressed against the back surface of the metal plate.

On the other hand, the inventors of the present application have considered that the metal plate is fixed to a mount at three or more fixing points because the imaging element may be tilted if the metal plate is tilted. However, in a case where, for example, an elastic component is provided at each fixing point in order to adjust the tilting of the metal surface, if the electrically-conductive component having been pressed against the back surface of the metal plate is inappropriately disposed, the metal plate may be tilted, which may cause the imaging element to be tilted.

Therefore, the present disclosure is to make available an imaging device that allows an image interference caused by an external noise to be reduced while preventing an imaging element from tilting also when the imaging device is used in intense electric field environments.

The present disclosure is directed to an imaging device that allows image interference caused by an external noise to be reduced. In order to attain the aforementioned object, the imaging device of the present disclosure includes: an imaging element configured to capture an optical image of an object, and generate image data; a main circuit substrate, disposed behind the imaging element, configured to perform signal processing of the image data generated by the imaging element; a mounting component configured to mount the imaging element; a metal plate, disposed between the mounting component and the main circuit substrate, having a front surface on which the mounting component is mounted; a mount, disposed in front of the metal plate, configured to support the metal plate by connection sections extending forward from the metal plate being fixed at at least three fixing points; a plurality of elastic components, provided at each fixing point of the mount, configured to urge the connection sections; and an electrically-conductive component configured to electrically connect between a ground conductor of the main circuit substrate and the metal plate. The electrically-conductive component is disposed such that a connection point with the metal plate is positioned in a area which is formed by the at least three fixing points being sequentially connected in the case of a back surface of the metal plate being viewed in a direction orthogonal thereto.

For example, the connection point is positioned in an area in which the metal plate and the imaging element overlap each other in the case of the back surface of the metal plate being viewed in the direction orthogonal thereto. Further, the electrically-conductive component is an electrically-conductive elastic component formed to be elastically deformable.

A compression load from the mount toward the metal plate is applied to each elastic component. In a case where a compression load from the main circuit substrate toward the metal plate is applied to the electrically-conductive elastic component, in a state where the imaging element is positioned to be orthogonal to a horizontal direction, a sum of compression loads applied to all the elastic components is greater than the compression load applied to the electrically-conductive elastic component when the number of the electrically-conductive elastic components is one, and a sum of compression loads applied to all the elastic components is greater than a sum of compression loads applied to all the electrically-conductive elastic components when the number of the electrically-conductive elastic components is plural.

The main circuit substrate has the ground conductor embedded therein. In the main circuit substrate, an introduction portion is formed, as an opening or a cut portion, in a portion of an insulating layer that covers the ground conductor, on a surface on the metal plate side, and the electrically-conductive component is connected to the ground conductor via the introduction portion.

For example, in the main circuit substrate, an integrated circuit for AD conversion for performing digital conversion of the image data is disposed, in an area near the introduction portion, on the same surface as the surface on which the introduction portion is formed. Alternatively, in the main circuit substrate, an integrated circuit for AD conversion for performing digital conversion of the image data is disposed, in an area opposite to an area of the introduction portion, on a surface reverse of the surface on which the introduction portion is formed.

As described above, in the imaging device of the present disclosure, a load point of the electrically-conductive component is positioned in the load positioning area surrounded by three fixing points on the metal plate, thereby applying a load from the electrically-conductive component to the metal plate in a balanced manner. Therefore, tilting of the metal plate is prevented and tilting of the imaging element can be prevented. Therefore, also when the imaging device is used in an intense electric field environment, image interference caused by an external noise can be reduced while preventing the imaging element from tilting. These and other objects, features, aspects and advantages of the present disclosure will become more apparent from the following detailed description of the present disclosure when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating an outer appearance of a digital camera (which is an exemplary imaging device) according to a first embodiment;

FIG. 2 is a perspective view of an outer appearance of a camera main body from which an exchangeable lens unit is removed;

FIG. 3 is a schematic cross-sectional view of an internal structure of the digital camera;

FIG. 4 is a functional block diagram illustrating the digital camera;

FIG. 5 is a cross-sectional view illustrating an internal structure of the imaging device, as viewed from thereabove, according to the first embodiment;

FIG. 6A is a perspective view of a main circuit substrate;

FIG. 6B is a perspective view of the main circuit substrate to which an electrically-conductive component has been connected;

FIG. 7 illustrates positioning of the electrically-conductive component relative to a metal plate;

FIG. 8 illustrates a variation of positioning of a metal-plate-side connection component and an elastic component relative to the metal plate;

FIG. 9 illustrates a variation of positioning of the metal-plate-side connection component and the elastic component relative to the metal plate;

FIG. 10 illustrates a variation of positioning of the metal-plate-side connection component and the elastic component relative to the metal plate;

FIG. 11 is a cross-sectional view illustrating an internal structure of the imaging device, as viewed from thereabove, according to the first embodiment;

FIG. 12 is a cross-sectional view illustrating an internal structure of an imaging device, as viewed from thereabove, according to a second embodiment ;

FIG. 13A is a perspective view of a main circuit substrate; and

FIG. 13B is a perspective view of the main circuit substrate to which the electrically-conductive component has been connected.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

First Embodiment

FIG. 1 is a perspective view illustrating an outer appearance of a digital camera (which is an exemplary imaging device) according to a first embodiment. The digital camera according to the first embodiment includes a camera main body 1 and an exchangeable lens unit 2 which is mountable to the camera main body 1. FIG. 2 is a perspective view of an outer appearance of the camera main body 1 from which the exchangeable lens unit 2 is removed. FIG. 3 is a schematic cross-sectional view of an internal structure of the digital camera. FIG. 4 is a functional block diagram illustrating the digital camera.

Firstly, referring to FIG. 1 to FIG. 4, a fundamental structure of the digital camera according to the first embodiment will be described. In the description herein, for convenience of description, an object side of the digital camera is referred to as the front, and an imaging plane side of the digital camera is referred to as the rear or the back.

As shown in FIG. 1, the camera main body 1 includes a main body casing 3, a body mount 4, a camera monitor 5, an electronic view finder (EVF) 6, and an operation section 7. The body mount 4 is disposed on the front surface side of the main body casing 3, and allows the exchangeable lens unit 2 to be mounted to the camera main body 1. The camera monitor 5 is disposed on the back surface side of the main body casing 3, and is implemented as a liquid crystal display or the like. The EVF 6 is disposed on the back surface side of the main body casing 3, and displays, for example, an image represented by display image data. The operation section 7 is disposed on the top portion of the main body casing 3, and includes, for example, a power switch 7 a, and a release button 7 b that receives a shutter operation from a user.

The exchangeable lens unit 2 has, in a lens barrel 2 a made of a resin, an optical system including a group of lenses 28, 29 and 30 that are arrayed on an optical axis AX for forming an optical image of an object. On the outer circumferential portion of the lens barrel 2 a, a zoom ring 25, a focus ring 26, and an OIS (Optical Image Stabilizer) switch 27 are provided. In the exchangeable lens unit 2, positions of lenses in the lens barrel 2 a can be adjusted by rotating the zoom ring 25 and the focus ring 26.

As shown in FIG. 2, the body mount 4 is structured so as to allow the exchangeable lens unit 2 to be mounted to the camera main body 1. The body mount 4 includes a terminal support section 4 a, a body mount ring 4 b, and a connection terminal 4 c. On the front surface of the camera main body 1 on which the exchangeable lens unit 2 is mounted to the camera main body 1, a shutter unit 12 and a diaphragm 13 are provided.

As shown in FIG. 3, in the main body casing 3 of the camera main body 1, a circuit substrate 9 (mounting component) on which an image sensor 8 implemented as a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device) is mounted, and a main circuit substrate 11 including a camera controller 10, are provided. Further, in the main body casing 3 of the camera main body 1, the body mount 4, the shutter unit 12, the diaphragm 13, an optical low pass filter 14, the image sensor 8, the circuit substrate 9, a metal component 20, the main circuit substrate 11, and the camera monitor 5 are disposed in order, respectively, from the front.

A diaphragm support section 13 a supports the diaphragm 13 such that the diaphragm 13 is disposed at a determined position relative to the image sensor 8. The diaphragm support section 13 a is supported by a main frame 18 via the body mount 4 and the shutter unit 12. The diaphragm 13 and the diaphragm support section 13 a prevent dust from attaching to the image sensor 8.

The optical low pass filter 14 removes a high frequency component of light of an object such that an object image which is formed by the exchangeable lens unit 2 has a resolution lower than that based on pitches of pixels of the image sensor 8. In general, in an imaging element such as the image sensor 8, a color filter, for RGB colors, which includes an array called a Bayer array and/or a complementary color filter for YCM colors, are arranged for each pixel. Therefore, if an image of an object is formed with the same resolution as that of the image sensor, not only a false color occurs, but also a moiré phenomenon occurs to make viewing difficult in the case of a repeated pattern of an object. Therefore, the optical low pass filter 14 is disposed so as to avoid such a problem. The optical low pass filter 14 has an IR protection filter function for filtering out infrared light.

The main frame 18 that is made of a metal and is disposed in the main body casing 3 is connected to the terminal support section 4 a of the body mount 4, and supports the exchangeable lens unit 2 via the body mount 4. Further, a tripod mounting section 19 having a screw hole for mounting a tripod is mechanically connected to the main frame 18. The screw hole of the tripod mounting section 19 is exposed on the bottom surface of the main body casing 3. Further, the metal component 20 disposed so as to surround the circuit substrate 9 to which the image sensor 8 has been mounted is a component for enhancing dissipation of heat generated in the image sensor 8. The metal component 20 includes a metal plate 20 a (orthogonal to the optical axis AX) disposed between the circuit substrate 9 and the main circuit substrate 11, and a thermally-conductive section 20 b (parallel to the optical axis AX) for transferring heat from the metal plate 20 a to the body mount 4.

The body mount 4 is a component for mounting the exchangeable lens unit 2 to the camera main body 1. The body mount 4 is mechanically and electrically connected to a lens mount 21 of the exchangeable lens unit 2. The body mount 4 includes: a body mount ring 4 b that is made of a metal, is ring-shaped, and is mounted to the front surface of the main body casing 3; and the connection terminal 4 c provided in the terminal support section 4 a. A connection terminal 21 a provided in the lens mount 21 is electrically connected to the connection terminal 4 c when the exchangeable lens unit 2 is mounted to the camera main body 1.

The body mount ring 4 b of the body mount 4 and a lens mount ring 21 b that is made of a metal and is provided in the lens mount 21 of the exchangeable lens unit 2, fit into each other, whereby the exchangeable lens unit 2 is mechanically held by the camera main body 1. The lens mount ring 21 b fits into the body mount ring 4 b by means of a so-called bayonet mechanism.

Specifically, the lens mount ring 21 b is put into a first state in which the lens mount ring 21 b does not fit into the body mount ring 4 b or a second state in which the lens mount ring 21 b fits into the body mount ring 4 b, according to a relationship in rotated position about the optical axis between the body mount ring 4 b and the lens mount ring 21 b. In the first state, the lens mount ring 21 b is movable relative to the body mount ring 4 b in the optical axis direction, and can be inserted into the body mount ring 4 b. When the lens mount ring 21 b is rotated relative to the body mount ring 4 b in a state where the lens mount ring 21 b has been inserted into the body mount ring 4 b, the lens mount ring 21 b fits into the body mount ring 4 b. At this time, a relationship in rotated position between the body mount ring 4 b and the lens mount ring 21 b represents the second state.

Further, the connection terminal 4 c electrically contacts with the connection terminal 21 a of the lens mount 21 in a state where the exchangeable lens unit 2 is mounted to the camera main body 1. Thus, the body mount 4 and the lens mount 21 are electrically connected to each other via the connection terminal 4 c of the body mount 4 and the connection terminal 21 a of the lens mount 21. As a result, in the digital camera, image data signals and control signals can be transmitted and received between the camera main body 1 and the exchangeable lens unit 2 via the body mount 4 and the lens mount 21.

Referring to FIG. 4, an internal function of the camera main body 1 will be firstly described in detail.

The body mount 4 and the lens mount 21 are connected to each other such that image data and control signals can be transmitted and received between the camera controller 10 and a lens controller 22 provided in the exchangeable lens unit 2. Further, in the main body casing 3, a power supply block 15 implemented as, for example, a battery is provided for supplying power to each component such as the camera controller 10. The power supply block 15 also supplies power to the entirety of the exchangeable lens unit 2 via the body mount 4 and the lens mount 21.

The image sensor 8 operates based on a timing signal supplied from a timing signal generator (TG) 9 a mounted to the circuit substrate 9, and converts, to image data, an object image which is an optical image of an object obtained via the exchangeable lens unit 2, to generate still image data, moving image data, or the like. Image data, such as the still image data or moving image data, generated by the image sensor 8 is converted to a digital signal by an ADC (analog-to-digital converter) 9 b mounted to the circuit substrate 9, and is subjected to various image processing by the camera controller 10. The various image processing performed by the camera controller 10 includes, for example, a gamma correction process, a white balance correction process, a flaw correction process, a YC conversion process, an electronic zoom process, and a JPEG compression process. The function of the circuit substrate 9 may be included in the main circuit substrate 11.

Further, the image data generated by the image sensor 8 is used for displaying a through-the-lens image. The through-the-lens image is an image represented by moving image data, and the data of the through-the-lens-image is not stored in a memory card 16. The through-the-lens image is displayed on the camera monitor 5 and/or the EVF 6 in order to compose a moving image or a still image.

The camera controller 10 is mounted to the main circuit substrate 11. The camera controller 10 controls each component of the camera main body 1, and transmits a signal for controlling the exchangeable lens unit 2, to the lens controller 22, via the body mount 4 and the lens mount 21. On the other hand, the camera controller 10 receives various signals from the lens controller 22 via the body mount 4 and the lens mount 21. Thus, the camera controller 10 indirectly controls each component of the exchangeable lens unit 2.

Further, the camera controller 10 uses, as a work memory, a DRAM 11 a mounted to the main circuit substrate 11 during a control operation and an image processing operation. Further, a card slot 17 is formed for inputting from and outputting to the memory card 16 mounted to the camera main body 1 still image data and moving image data, according to a control signal transmitted from the camera controller 10.

The shutter unit 12 is a so-called focal plane shutter. The shutter unit 12 is disposed between the body mount 4 and the image sensor 8, and can shield the image sensor 8 from light. The shutter unit 12 includes a first shutter curtain, a second shutter curtain, and a shutter support frame having an opening through which light is guided from an object to the image sensor 8. The shutter unit 12 moves to or retracts from the opening of the shutter support frame the first shutter curtain and the second shutter curtain, to adjust an exposure time of the image sensor 8.

Next, an internal function of the exchangeable lens unit 2 will be described in detail.

The exchangeable lens unit 2 has, in the lens barrel 2 a made of a resin, the optical system including a group of lenses 28, 29 and 30 arrayed on the optical axis AX for forming an optical image of an object, the lens mount 21, the lens controller 22, an aperture unit 23, and a driving section 24 for driving the group of lenses 28, 29 and 30 of the optical system.

Further, the zoom ring 25, the focus ring 26, and the OIS switch 27 are provided on the outer circumferential portion of the lens barrel 2 a. The exchangeable lens unit 2 is allowed to adjust positions of the lenses in the lens barrel 2 a by the zoom ring 25 and the focus ring 26 being rotated.

The optical system has a group of lenses 28 for zooming, a group of lenses 29 for OIS, and a group of lenses 30 for focusing. The group of lenses 28 for zooming operates so as to change a focal distance of the optical system. The group of lenses 29 for OIS operates so as to restrain, for the image sensor 8, blurring of an object image which is formed by the optical system. The group of lenses 30 for focusing operates so as to change a focus state of an object image formed on the image sensor 8 by the optical system.

The aperture unit 23 is a light amount adjustment component that adjusts an amount of light transmitted through the optical system. Specifically, the aperture unit 23 includes aperture blades that can block a portion of light beams transmitted through the optical system, and an aperture driving section for driving the aperture blades.

The driving section 24 drives the group of lenses 28, 29 and 30 of the optical system described above, based on a control signal from the lens controller 22. The driving section 24 has a detection section for detecting positions of the group of lenses 28, 29 and 30 of the optical system.

The lens controller 22 controls the entirety of the exchangeable lens unit 2 based on a control signal transmitted from the camera controller 10 of the camera main body 1. The lens controller 22 receives positional information of the group of lenses 28, 29 and 30 of the optical system as detected by the detection section of the driving section 24, and transmits the positional information to the camera controller 10. The camera controller 10 generates a control signal for controlling the driving section 24 based on the positional information received from the lens controller 22, and transmits the control signal to the lens controller 22.

The lens controller 22 transmits, to the driving section 24, the control signal generated by the camera controller 10. The driving section 24 adjusts positions of the group of lenses 28, 29 and 30 based on the control signal transmitted from the lens controller 22.

On the other hand, the camera controller 10 generates a control signal for operating the aperture unit 23, based on information indicating, for example, an amount of light received by the image sensor 8, whether a still image is to be photographed or a moving image is to be photographed, and whether or not an operation is being performed so as to preferentially set an aperture value. At this time, the lens controller 22 relays the control signal generated by the camera controller 10, to the aperture unit 23.

A DRAM 22 a and a flash memory 22 b are held in the exchangeable lens unit 2. The lens controller 22 uses the DRAM 22 a as a work memory when drives the group of lenses 28, 29 and 30 of the optical system and the aperture unit 23. In the flash memory 22 b, programs and parameters used by the lens controller 22 are stored.

Thus, the digital camera (which is an exemplary imaging device) according to the first embodiment has been described with reference to FIG. 1 to FIG. 4. However, the imaging device may be another imaging device which uses an electrically-conductive component connecting between a metal plate described below, and the main circuit substrate.

Hereinafter, connection between a metal plate and GND of the main circuit substrate will be described in detail as means for reducing image interference caused by an external nose. The “GND” may be represented as “ground” or “earth.”

FIG. 5 is a cross-sectional view illustrating an internal structure of an imaging device 100, as viewed from thereabove, according to the first embodiment. In the description herein, control of a GND potential by a metal plate 150 will be mainly described, and detailed description of matters other than the control is omitted. The fundamental structure of the imaging device 100 is the same as described for the digital camera with reference to FIG. 1 to FIG. 4.

As shown in FIG. 5, the imaging device 100 includes an imaging element 110, a main circuit substrate 120, an imaging element flexible cable 130, a mount 140, an exchangeable lens mount section 145, a metal plate 150, connection sections 160, elastic components 165, and an electrically-conductive component 190. The electrically-conductive component 190 is formed of a metal having a high electrical conductivity. The main circuit substrate 120 has a GND removal portion 180, as described below, on the front surface on the metal plate 150 side. Further, the main circuit substrate 120 has an AD conversion LSI 185 for performing a digital conversion of image data generated by the imaging element 110, on the back surface on a side opposite to the metal plate 150 side. The AD conversion LSI 185 is disposed on the back surface of the main circuit substrate 120 in an area opposite to an area of the GND removal portion 180 to which the electrically-conductive component 190 is connected.

The imaging element 110 is implemented as, for example, a CMOS or a CCD, and corresponds to the image sensor 8 described above. On the front surface of the imaging element 110, an object image which is an optical image of an object obtained via the group of lenses 28, 29 and 30, is formed. The imaging device 110 converts the object image into image data, to generate still image data, moving image data, or the like.

The main circuit substrate 120 corresponds to the main circuit substrate 110 described above. The main circuit substrate 120 includes the camera controller 10 that performs various signal processing of the image data generated by the imaging element 110. In the description herein, the various signal processing is the image processing described above, and includes, for example, a gamma correction process, a white balance correction process, a flaw correction process, a YC conversion process, an electronic zoom process, and a JPEG compression process. The main circuit substrate 120 is a rectangular substrate having an area greater than that of the imaging element 110. The main circuit substrate 120 is fixed to the main body casing 3 behind the imaging element 110 so as to be almost parallel to the imaging element 110. Further, the main circuit substrate 120 is a multilayered substrate having a GND layer (GND conductor) thereinside. On the main circuit substrate 120, the GND removal portion 180 is formed as an exposed portion of the GND layer by a portion of an insulating layer that covers the GND layer being removed.

The imaging element flexible cable 130 has four cable end connection portions that are connected to the main circuit substrate 120, and is formed so as to be roughly H-shaped. The imaging element flexible cable 130 includes a pair of band portions each having the cable end connection portions on both ends, and a rectangular central connection portion connecting between central portions of the paired band portions. The paired band portions are spaced from each other and extend parallel to each other. In the imaging element flexible cable 130, the band portions correspond to longitudinal lines, respectively, of the H shape, and the central connection portion corresponds to a transverse line of the H shape. The imaging element flexible cable 130 corresponds to, for example, the circuit substrate 9 (mounting component) described above, and allows the imaging element 110 to be mounted to the central connection portion. The imaging element 110 is mounted so as to protrude from the central connection portion toward each band portion. A plurality of signal lines are embedded in each band portion so as to extend from each cable end connection portion to the imaging element 110. The imaging element flexible cable 130 is supported by the main circuit substrate 120 by each cable end connection portion being connected to the main circuit substrate 120.

The mount 140 corresponds to, for example, the body mount 4 described above. The mount 140 is a component for allowing the lens unit 2 to be mounted to the main body casing 3. The mount 140 is fixed to the main body casing 3 and has a GND potential. The mount 140 is disposed in front of the imaging element 110. The mount 140 also secures an SSWF (Super Sonic Wave Filter) (not shown) for removing dust on the surface of the imaging element 110, a shutter unit (not shown), and a flash unit (not shown). Further, the mount 140 is formed of a metal material such as aluminum or a stainless steel (SUS), in order to enhance reliability in heat-dissipation and reliability against drop impact, and to address unnecessary electromagnetic radiation. The exchangeable lens mount section 145 corresponds to the lens mount 21 described above.

The metal plate 150 is formed in a roughly rectangular shape. The metal plate 150 is disposed between the imaging element 110 and the main circuit substrate 120. The metal plate 150 is provided so as to be almost parallel to the main circuit substrate 120. The metal plate 150 is electrically connected to the GND removal portion 180 of the main circuit substrate 120 via the electrically-conductive component 190. A connection portion between the GND removal portion 180 and the electrically-conductive component 190 will be described below in detail.

Further, the metal plate 150 corresponds to, for example, the metal plate 20 a of the metal component 20 described above. The metal plate 150 is fixed to a mounting area of the imaging element flexible cable 130 in which the imaging element 110 is mounted, or disposed near the mounting area, in order to transfer heat generated in the imaging element 110. In the first embodiment, the metal plate 150 is adhered to an area opposite to the mounting area. The metal plate 150 is formed of a metal material, such as aluminum or copper, having a high thermal conductivity and electrical conductivity, to efficiently dissipate heat transferred from the imaging element 110. A portion at which the metal plate 150 is mounted to the mounting area is not limited to an area opposite to the mounting area.

The connection sections 160 are components that extend forward from the metal plate 150 so as to fix the metal plate 150 to the mount 140 at three or more fixing points. In the first embodiment, the number of the fixing points is three. The connection sections 160 have an electrical conductivity. The connection sections 160 electrically connect between the mount 140 and the metal plate 150 via the elastic components 165 provided at each fixing point. The connection sections 160 are fixed to the mount 140 at each fixing point by the use of screws formed of a metal material in a state where the connection sections 160 are urged by the elastic components 165. When the camera main body 1 is assembled, before an assembly in which the mount 140 and the metal plate 150 are connected to each other via the connection sections 160, is fixed to the main body casing 3, the screw at each fixing point is screwed to adjust the tilting of the metal plate 150. In the assembly, the imaging element flexible cable 130 and the imaging element 110 are also mounted to the metal plate 150. The connection sections 160 connect between the mount 140 and the metal plate 150 via the elastic components 165. The elastic components 165 are elastically deformable so as to allow the tilting of the metal plate 150 to be adjusted. The shape of each elastic component 165 is not limited to the shape shown in FIG. 5. Further, the connection sections 160 may be formed of, for example, a steel material which is less likely to be elastically deformed, as a part of the metal plate 150. In this case, for example, the outer circumferential portion of the metal plate 150 is bent toward the front surface side, to form the connection sections 160 that protrude from a main body portion of the metal plate 150 toward the mount 140. Further, in the description herein, the “fixing point” does not represent a point having no area, unlike that represented by a mathematical term. A “fixing point” may be represented as a “fixing portion.”

Next, a connection portion between the main circuit substrate 120 and the electrically-conductive component 190 will be specifically described. FIG. 6A is a perspective view of the main circuit substrate 120. As shown in FIG. 6A, the main circuit substrate 120 has the GND removal portion 180 on the front surface on the metal plate 150 side. The GND removal portion 180 is an area on the front surface of the main circuit substrate 120 in which a resist is removed, and has a GND potential. FIG. 6B is a perspective view of the main circuit substrate 120 to which the electrically-conductive component 190 has been connected. As shown in FIG. 6B, on the main circuit substrate 120, the GND removal portion 180 and the electrically-conductive component 190 are connected to each other. The shape of the electrically-conductive component 190 is not limited to the shape shown in FIG. 5 and FIG. 6B. Further, an area of a portion in which the electrically-conductive component 190 contacts with the metal plate 150 is favorably great in light of heat dissipating performance and the like.

FIG. 7 illustrates positioning of the electrically-conductive component 190 relative to the metal plate 150. FIG. 7 illustrates the metal plate 150 as viewed from the back surface side of the imaging device 100. FIG. 7 illustrates the back surface of the metal plate 150 as viewed in the direction orthogonal thereto. As shown in FIG. 7, the connection sections 160 of the metal plate 150 are fixed to the mount 140 at three fixing points. The right angle degree of the imaging element 110 (namely, the degree to which an angle between the optical axis AX and the imaging element 110 is proximate to the right angle) is defined by elastic force of the elastic components 165.

A triangular area surrounded by the three elastic components 165 (the three fixing points) is referred to as a load positioning area 195 in the case of the back surface of the metal plate 150 being viewed in the direction orthogonal thereto. The electrically-conductive component 190 is disposed so as to position a load point 196 of the electrically-conductive component 190 in the load positioning area 195. The load point 196 of the electrically-conductive component 190 is a contact point between the electrically-conductive component 190 and the metal plate 150, and represents an area in which a load (pressing load) is applied from the electrically-conductive component 190 to the metal plate 150. When the electrically-conductive component 190 is thus disposed, a load is applied from the electrically-conductive component 190 to the metal plate 150 in a balanced manner. Therefore, tilting of the metal plate 150 can be prevented, and tilting of the imaging element 110 can be prevented. The connection sections 160 may be fixed at four or more fixing points via the elastic components 165. Further, each connection section 160 may diverge into a plurality of portions in the mid-portion thereof, and the diverging heads may be fixed to the mount 140 via the elastic components 165. The electrically-conductive component 190 may be merely connected to the metal plate 150 without applying a pressing load from the electrically-conductive component 190 to the metal plate 150 in a state where the imaging element 110 is positioned so as to be orthogonal to the horizontal direction.

Further, the electrically-conductive component 190 may be disposed such that the load point 196 of the electrically-conductive component 190 is positioned on the metal plate 150 in or near an area (hereinafter, referred to as an opposite area 197 that is an area opposite to an area of the imaging element 110) just opposite to an area in which the imaging element 110 is disposed in the case of the back surface of the metal plate 150 being viewed in the direction orthogonal thereto. In other words, the opposite area 197 is an area in which the metal plate 150 and the imaging element 110 overlap each other in the case of the back surface of the metal plate 150 being viewed in the direction (direction orthogonal to the metal plate 150) orthogonal thereto (as viewed through the metal plate 150). When the electrically-conductive component 190 is thus disposed, an impedance of GND of the opposite area 197 near the imaging element 110 in the metal plate 150 is reduced, whereby an influence of an external electromagnetic wave which enters the imaging element 110 can be effectively eliminated.

Although, in the example shown in FIG. 7, the number of the load points 196 of the electrically-conductive component 190 is one, the number of the load points 196 of the electrically-conductive component 190 may be greater than or equal to two. However, in a case where the number of the load points 196 of the electrically-conductive component 190 is greater than or equal to two, at least one load point is positioned in the load positioning area 195 or in the opposite area 197 that is an area opposite to an area of the imaging element 110 as described above. Further, the opposite area 197 that is an area opposite to an area of the imaging element 110 may overlap the load positioning area 195. In this case, the electrically-conductive component 190 may be disposed so as to position the load point 196 in an area, on the metal plate 150, in which the load positioning area 195 overlaps the opposite area 197 that is an area opposite to an area of the imaging element 110. In such positioning, tilting of the imaging element 110 can be prevented, and an influence of an external electromagnetic wave which enters the imaging element 110 can be efficiently eliminated.

Further, the electrically-conductive component 190 may be an electrically-conductive elastic component 190 having an elastic function in addition to electrical conductivity. The electrically-conductive elastic component 190 is formed of a metal, such as aluminum and copper, having a high electrical conductivity, in an elastically deformable shape. When the electrically-conductive component 190 has an elastic function, a stress applied to the metal plate 150 adhered to the mounting area is reduced. As a result, generation of stress applied to the imaging element 110 is restrained, and tilting of the imaging element 110 can be restrained.

It is assumed that, for example, a compression load F1 is applied from the mount 140 toward each connection section 160 at a corresponding one of the elastic components 165 provided between the mount 140 and the connection section 160 in a state where the optical axis AX is in a horizontal state (a state where the imaging element is positioned so as to be orthogonal to the horizontal direction). Further, it is assumed that a compression load F2 is applied from the main circuit substrate 120 toward the metal plate 150 at the electrically-conductive elastic component 190 provided between the main circuit substrate 120 and the metal plate 150. In this case, a sum of the compression loads applied to all the elastic components 165 is made greater than the compression load applied to the electrically-conductive elastic component 190. For example, when the compression loads F1 applied to all the elastic components 165, respectively, are equal to each other, a relationship of mF1>F2 is satisfied. m represents the number of the elastic components 165, and represents an integer greater than or equal to three. When this relationship is satisfied, a load applied from the electrically-conductive elastic component 190 to the metal plate 150 can be reduced. Therefore, titling of the metal plate 150 can be prevented, and titling of the imaging element 110 can be prevented.

The number of the electrically-conductive components 190 (the electrically-conductive elastic components 190) provided in the imaging device 100 may be plural and the number of the GND removal portions 180 provided in the imaging device 100 may be plural. In such a case, it is assumed that a load F2 is applied from the main circuit substrate 120 toward the metal plate 150 at each electrically-conductive elastic component 190 provided between the main circuit substrate 120 and the metal plate 150 in a state where the optical axis AX is in a horizontal state. In this case, a sum of compression loads applied to all the elastic components 165 is made greater than compression loads applied to all the electrically-conductive elastic components 190. For example, when the compression loads F1 applied to all the elastic components 165, respectively, are equal to each other, and the compression loads F2 applied to all the electrically-conductive elastic components 190, respectively, are equal to each other, a relationship of mF1>nF2 is satisfied. m represents the number of the elastic components 165, and represents an integer greater than or equal to three. n represents the number of the electrically-conductive elastic components 190, and represents an integer greater than or equal to two. Namely, also when the number of the load points 196 of the electrically-conductive elastic component 190 is plural, a similar relationship is satisfied.

Next, variations of positioning of the connection sections 160 and the elastic components 165 relative to the metal plate 150 will be described. FIGS. 8 to 10 illustrate variations of positioning of the connection sections 160 and the elastic components 165 relative to the metal plate 150. As shown in FIGS. 8 to 10, the metal plate 150 may be fixed to the mount 140 in a balanced manner by means of at least three sets of the connection sections 160 and the elastic components 165.

Further, the imaging device 100 may be structured as shown in, for example, FIG. 11. In the imaging device 100 shown in FIG. 11, an imaging element substrate 115 (mounting component) is mounted on the imaging element flexible cable 130, and the imaging element 110 is mounted on the imaging element substrate 115.

As described above, in the imaging device 100 according to the first embodiment, the GND removal portion 180 of the main circuit substrate 120 and the metal plate 150 are electrically connected to each other via the electrically-conductive component 190, to reduce an impedance of GND of the metal plate 150. As a result, variation in GND potential in the imaging element 110 can be restrained.

Further, the electrically-conductive component 190 is disposed so as to position the load point 196 of the electrically-conductive component 190 in the load positioning area 195, on the metal plate 150, surrounded by the three elastic components 165, thereby applying a load from the electrically-conductive component 190 to the metal plate 150 in a balanced manner. Therefore, titling of the metal plate 150 can be prevented, and tilting of the imaging element 110 can be prevented.

Further, in the imaging device 100 according to the first embodiment, an electrically conductive filter for reducing an amount of light incident on the lenses is not used. Therefore, also when the imaging device is used in an intense electric field environment, an image interference caused by an external noise can be reduced without deteriorating an image quality of a captured image. Further, the electrically-conductive component 190 is not so great component, and has a simplified internal configuration, thereby downsizing the imaging element.

Second Embodiment

FIG. 12 is a cross-sectional view illustrating an internal structure of an imaging device 200, as viewed from thereabove, according to a second embodiment. In description herein, difference from the first embodiment will be mainly described. A fundamental configuration of the imaging device 200 is the same as that of the digital camera described with reference to FIG. 1 to FIG. 4.

As shown in FIG. 12, the imaging device 200 includes the imaging element 110, the main circuit substrate 120, the imaging element flexible cable 130, the mount 140, the exchangeable lens mount section 145, the metal plate 150, the connection sections 160, the elastic components 165, and the electrically-conductive component 190. Further, the main circuit substrate 120 has the GND removal portion 180 and the AD conversion LSI 185 (an integrated circuit for AD conversion) on the front surface on the metal plate 150 side. In FIG. 12, the same components as described for the imaging device 100, as shown in FIG. 5, according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In the description herein, difference from the first embodiment will be mainly described.

The imaging device 200 according to the second embodiment is different from the imaging device 100 according to the first embodiment in that, in the second embodiment, the AD conversion LSI 185 is mounted on the front surface (namely, the same surface as the surface on which the GND removal portion 180 is formed) of the main circuit substrate 120 on the metal plate 150 side. The AD conversion LSI 185 is disposed, on the front surface of the main circuit substrate 120, in an area near the GND removal portion 180 to which the electrically-conductive component 190 is connected. FIG. 13A is a perspective view of the main circuit substrate 120. In FIG. 13A, the main circuit substrate 120 has the GND removal portion 180 and the AD conversion LSI 185 on the same surface. FIG. 13B is a perspective view of the main circuit substrate 120 to which the electrically-conductive component 190 has been connected. As shown in FIG. 13B, the GND removal portion 180 and the electrically-conductive component 190 are connected to each other on the main circuit substrate 120.

As described above, with the imaging device 200 according to the second embodiment, the same effect as in the first embodiment can be obtained. Namely, in the imaging device 200 according to the second embodiment, also when the imaging device is used in an intense electric field environment, an image interference caused by an external noise can be reduced without deteriorating an image quality of a captured image. Further, the internal configuration is simplified, thereby downsizing the imaging element.

While the disclosure has been described in detail as above, the foregoing description is in all aspects illustrative and not restrictive. It will be understood that numerous other modifications and variations can be devised without departing from the scope of the disclosure. 

What is claimed is:
 1. An imaging device for taking an image of an object, the imaging device comprising: an imaging element configured to capture an optical image of an object, and generate image data; a main circuit substrate, disposed behind the imaging element, configured to perform signal processing of the image data generated by the imaging element; a mounting component configured to mount the imaging element; a metal plate, disposed between the mounting component and the main circuit substrate, having a front surface on which the mounting component is mounted; a mount, disposed in front of the metal plate, configured to support the metal plate by connection sections extending forward from the metal plate being fixed at at least three fixing points; a plurality of elastic components, provided at each fixing point of the mount, configured to urge the connection sections; and an electrically-conductive component configured to electrically connect between a ground conductor of the main circuit substrate and the metal plate, wherein the electrically-conductive component is disposed such that a connection point with the metal plate is positioned in a area which is formed by the at least three fixing points being sequentially connected in the case of a back surface of the metal plate being viewed in a direction orthogonal thereto.
 2. The imaging device according to claim 1, wherein the connection point is positioned in an area in which the metal plate and the imaging element overlap each other in the case of the back surface of the metal plate being viewed in the direction orthogonal thereto.
 3. The imaging device according to claim 1, wherein the electrically-conductive component is an electrically-conductive elastic component formed to be elastically deformable.
 4. The imaging device according to claim 3, wherein a compression load from the mount toward the metal plate is applied to each elastic component, and in a case where a compression load from the main circuit substrate toward the metal plate is applied to the electrically-conductive elastic component, in a state where the imaging element is positioned to be orthogonal to a horizontal direction, a sum of compression loads applied to all the elastic components is greater than the compression load applied to the electrically-conductive elastic component when the number of the electrically-conductive elastic components is one, and a sum of compression loads applied to all the elastic components is greater than a sum of compression loads applied to all the electrically-conductive elastic components when the number of the electrically-conductive elastic components is plural.
 5. The imaging device according to claim 1, wherein the main circuit substrate has the ground conductor embedded therein, and in the main circuit substrate, an introduction portion is formed, as an opening or a cut portion, in a portion of an insulating layer that covers the ground conductor, on a surface on the metal plate side, and the electrically-conductive component is connected to the ground conductor via the introduction portion.
 6. The imaging device according to claim 5, wherein, in the main circuit substrate, an integrated circuit for AD conversion for performing digital conversion of the image data is disposed, in an area near the introduction portion, on the same surface as the surface on which the introduction portion is formed.
 7. The imaging device according to claim 5, wherein, in the main circuit substrate, an integrated circuit for AD conversion for performing digital conversion of the image data is disposed, in an area opposite to an area of the introduction portion, on a surface reverse of the surface on which the introduction portion is formed. 